DARPA Selects BAE to Build Powerful Next-Generation Advanced Electronics

 In Land, Defense, Air, Communications, Information

BAE Systems was award­ed a con­tract from the Defense Advanced Research Projects Agency (DARPA) to devel­op the next gen­er­a­tion of mixed-signal elec­tron­ics that could enable new Department of Defense (DoD) appli­ca­tions includ­ing high capac­i­ty, robust com­mu­ni­ca­tions, radars, and pre­ci­sion sen­sors, and lead to solu­tions that enhance sit­u­a­tion­al aware­ness and sur­viv­abil­i­ty for the warfight­er.

Recognizing that the DoD has per­for­mance demands that far exceed the capa­bil­i­ties of the com­mer­cial world in terms of speed, fideli­ty, capac­i­ty, and pre­ci­sion, DARPA cre­at­ed the Technologies for Mixed mode Ultra Scaled Integrated Circuits (T‑MUSIC) pro­gram to enable dis­rup­tive radio fre­quen­cy (RF) mixed-mode tech­nolo­gies by devel­op­ing high per­for­mance RF analog elec­tron­ics inte­grat­ed with advanced dig­i­tal elec­tron­ics on the same wafer.

The next-gen­er­a­tion capa­bil­i­ties that could be made pos­si­ble with this pro­gram include a com­bi­na­tion of wide spec­tral cov­er­age, high res­o­lu­tion, large dynam­ic range, and high infor­ma­tion pro­cess­ing band­width. These capa­bil­i­ties, which can cut through the elec­tron­ic signal clut­ter, pro­vide leap-for­ward per­for­mance that is mis­sion crit­i­cal as ser­vices rely on elec­tron­ic sen­sors in highly con­gest­ed envi­ron­ments. The new devel­op­ments could be inte­grat­ed into elec­tron­ic war­fare, com­mu­ni­ca­tions, pre­ci­sion muni­tions, and intel­li­gence, sur­veil­lance and recon­nais­sance plat­forms.

“T‑MUSIC will incor­po­rate analog and dig­i­tal sig­nals on a single chip for high-per­for­mance data con­vert­ers and dig­i­tal pro­cess­ing and intel­li­gence,” said Chris Rappa, prod­uct line direc­tor for Radio Frequency, Electronic Warfare, and Advanced Electronics at BAE Systems’ FAST Labs. “The advanced elec­tron­ics we are devel­op­ing under the T‑MUSIC pro­gram could create the foun­da­tion for great­ly enhanced Department of Defense capa­bil­i­ties in advanced RF sen­sors and high capac­i­ty com­mu­ni­ca­tions.”

As part of the $8 mil­lion con­tract, BAE Systems FAST Labs™ research and devel­op­ment team – work­ing close­ly with pro­gram foundries – will design and devel­op wafer-scale tech­nol­o­gy on a sil­i­con foundry plat­form that can enable U.S.-based pro­duc­tion of next-gen­er­a­tion DoD elec­tron­ics.

The T‑MUSIC con­tract adds to BAE Systems’ advanced elec­tron­ics port­fo­lio and is based on many years of invest­ment on var­i­ous pro­grams with the Air Force Research Lab (AFRL), U.S. Army, and DARPA, includ­ing DARPA’s CONverged Collaborative Elements for RF Task Operations (CONCERTO) and DARPA’s Radio Frequency Field Programmable Gate Arrays (RF-FPGA) pro­grams. Work for the con­tract will be com­plet­ed at the company’s facil­i­ties in Merrimack, New Hampshire; Lexington, Mass.; and Manassas, Virginia.

Source: DefenceTalk.com

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